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DISCRETE SEMICONDUCTORS
DATA SHEET
M3D391
KMI16/1 Integrated rotational speed sensor
Product specification Supersedes data of 1998 May 15 2000 Sep 05
Philips Semiconductors
Product specification
Integrated rotational speed sensor
DESCRIPTION The KMI16/1 sensor detects rotational speed of ferrous gear wheels and reference marks. The sensor consists of a magnetoresistive sensor element, a signal conditioning integrated circuit in bipolar technology and a ferrite magnet. The frequency of the digital current output signal is proportional to the rotational speed of the target wheel. The open collector (OC) output allows for a high degree of flexibility in the design of subsequent conditioning electronics. CAUTION Do not press two or more products together against their magnetic forces. Do not expose products to strong magnetic fields of more than 30 kA/m.
handbook, halfpage
KMI16/1
PINNING PIN 1 2 3 SYMBOL VCC Vout GND DESCRIPTION DC supply voltage open collector output ground
1
2
3
MBK766
Fig.1 Simplified outline (SOT477B).
QUICK REFERENCE DATA SYMBOL VCC ICC VCEsat dmax ft Tamb DC supply voltage DC supply current (pin 1) OC saturation voltage maximum sensing distance operating tooth frequency ambient operating temperature PARAMETER 4 - 2.4 0 -40 MIN. 4.5 5 10 - 2.9 - - TYP. MAX. 16 14 1 - 25000 +150 V mA V mm Hz C UNIT
2000 Sep 05
2
Philips Semiconductors
Product specification
Integrated rotational speed sensor
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL VCC PARAMETER DC operating supply voltage voltage pin 1 Vout Vout(max) Iout(max) Iout(off) Ptot Tsld Tstg Tamb OC output voltage peak OC output voltage OC output current OC output leakage current total power dissipation soldering temperature storage temperature ambient operating temperature CONDITIONS Tamb = -40 to +150 C MIN. 4.5
KMI16/1
MAX. 16 +16 +16 +26.5 20 100 200 260 +150 +150
UNIT V V V V mA A mW C C C
Tamb = -40 to +150 C; no wrong polarity -0.5 protection Tamb = -40 to +150 C; no wrong polarity -0.5 protection; see Fig.5 Tamb = -40 to +40 C; no wrong polarity protection; see Fig.5 Tamb = -40 to +150 C Tamb = -40 to +150 C Tamb = -40 to +150 C t 10 s -0.5 - - - - -65 -40
CHARACTERISTICS Tamb = 25 C; VCC = 5 V; d = 1.9 mm; ft = 2 kHz; test circuit see Fig.5; gear wheel: module 2.08 mm; material 9SMnPb28k; see Fig.6; centred sensor position; see notes 1, 2 and 3; unless otherwise specified. SYMBOL ICC Vout (high) VCE sat tr tf dmin dmax Notes 1. High rotational wheel speeds reduce the maximum sensing distance because of eddy currents, depending on target wheel dimensions and materials used. 2. Output pins are designed for electrostatic sensitivity for more than 2000 V according to Human Body Model (HBM); MIL-STD-883; method 3015. 3. EMC behaviour depends greatly on design of application circuit. PARAMETER supply current (pin 1) OC output voltage high OC saturation voltage output signal rise time output signal fall time duty cycle minimum sensing distance CONDITIONS Tamb = -40 to +150 C OC = on state; Iout = 20 mA 10% to 90% 10% to 90% Tamb = -40 to +150 C Tamb = -40 to +150 C 4 - 5 0.1 30 - 2.4 MIN. TYP. 10 4.9 0.4 12 0.4 50 0.3 2.9 MAX. 14 - 1 20 10 70 0.5 - UNIT mA V V s s % mm mm
OC = off state; Tamb = -40 to +150 C 4.7
maximum sensing distance Tamb = -40 to +150 C
2000 Sep 05
3
Philips Semiconductors
Product specification
Integrated rotational speed sensor
FUNCTIONAL DESCRIPTION The KMI16/1 sensor is sensitive to the motion of ferrous gear wheels or reference marks. The functional principle is shown in Fig.3. Due to the effect of flux bending, the different directions of magnetic field lines in the magnetoresistive sensor element will cause an electrical signal. Because of the chosen sensor orientation and the direction of ferrite magnetization, the KMI16/1 is sensitive to movement in the `y' direction in front of the sensor only (see Fig.2). The magnetoresistive sensor element signal is amplified, temperature compensated and passed to a Schmitt trigger in the conditioning integrated circuit (see Fig.4). The digital output signal level is independent of the sensing distance within the measuring range (see Fig.10). A (3-wire) output current enables safe transfer of the sensor signal to the detecting circuit (see Fig.5). The integrated circuit housing is separated from the sensor element housing to optimize the sensor behaviour at high temperatures.
handbook, halfpage
KMI16/1
x magnet with direction of magnetization
x z
y
sensor
IC
MBK767
Fig.2 Component detail of the KMI16/1.
gear handbook, full pagewidth wheel z magnet magnetic field lines direction of motion
sensor
y
MRA957
(a)
(b)
(c)
(d)
Fig.3 Functional principle.
2000 Sep 05
4
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
handbook, full pagewidth
VOLTAGE CONTROL
VCC
SENSOR
AMPLIFIER
SCHMITT TRIGGER
Vout open collector output
GND
MGL348
Fig.4 Block diagram.
handbook, halfpage
VCC 2.7 k 10 k
SENSOR 2.2 nF ICC
Vout
MGL347
Fig.5 Test and application circuit.
2000 Sep 05
5
Philips Semiconductors
Product specification
Integrated rotational speed sensor
APPLICATION INFORMATION Mounting conditions The recommended sensor position in front of a gear wheel is shown in Fig.11. The distance `d' is measured between the sensor front and the tip of a gear wheel tooth. The KMI16/1 senses ferrous indicators like gear wheels in the `y' direction only (no rotational symmetry of the sensor); see Fig.2. The effect of incorrect mounting positions on sensing distance is shown in Figs 7, 8 and 9. The symmetrical reference axis of the sensor corresponds to the axis of the ferrite magnet. Environmental conditions Due to eddy current effects the sensing distance depends on the tooth frequency (see Fig.13). The influence of the gear wheel module on the sensing distance is shown in Fig.12. Gear Wheel Dimensions SYMBOL German DIN z d m p ASA; note 1 PD DP CP Note pitch diameter (d in inch) diametric pitch DP = z/PD circular pitch CP = /DP number of teeth diameter module m = d/z pitch p = x m DESCRIPTION
KMI16/1
UNIT - mm mm mm
inch inch-1 inch
1. For conversion from ASA to DIN: m = 25.4 mm/DP; p = 25.4 mm x CP.
handbook, full pagewidth
10.00 2.080 0.01 8.00 3.50 M3
see detail Z
8H7 32
6.535 0.01
A 0.5 x 45 o 0.1 A 0.5 x 45 o
1
04
0
.05
10 o -0.1
2.08 0.1
R 0.5 0.5 x 45 o 0.05 A 0.5 x 45 o detail Z
MBL242
Fig.6 Gear wheel dimensions.
2000 Sep 05
6
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
handbook, halfpage
4
MRA998
handbook, halfpage
4
MRA999
d (mm) 3
d (mm) 3
2 y d 1
2 d 1
0 0
1
2
3 y (mm)
4
0 0
1
2
3
(deg)
4
VCC = 12 V; ft = 2 kHz; module = 2 mm; pitch diameter = 100 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.7 Sensing distance as a function of positional tolerance in the y-axis; typical values.
Fig.8
Sensing distance as a function of positional tolerance; typical values.
handbook, halfpage
4
MRA982
handbook, halfpage
4
MRA962
d (mm) 3
d (mm) 3
2 d
x
2 d
1
1
10 mm 0 -6 -4 -2 0 2 4 6 x (mm) 0 -50 0 50 100 150 200 Tamb (oC)
VCC = 12 V; ft = 2 kHz; module = 2 mm.
VCC = 12 V; ft = 2 kHz; module = 2 mm.
Fig.9
Sensing distance as a function of positional tolerance in the x-axis; typical values.
Fig.10 Sensing distance as a function of ambient temperature; typical values.
2000 Sep 05
7
Philips Semiconductors
Product specification
Integrated rotational speed sensor
KMI16/1
handbook, halfpage
1.5
MRA966
d d0
handbook, halfpage
sensor d
1
d
0.5
gear wheel
MRA963
0
0
1
2
3
4 5 module m (mm)
do = measuring distance for a gear wheel with module m = 2 mm.
Fig.11 Sensor positioning.
Fig.12 Normalized maximum sensing distance as a function of gear wheel module; typical values.
handbook, halfpage
4
MRA965
d (mm) 3
2 d 1 tooth frequency ft
0 0
1
2
3 f (kHz)
4
VCC = 12 V; module = 2 mm.
Fig.13 Sensing distance as a function of tooth frequency; typical values.
2000 Sep 05
8
Philips Semiconductors
Product specification
Integrated rotational speed sensor
PACKAGE OUTLINE Plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads
M1 HE1 E B vMAB K A Q
KMI16/1
SOT477B
A L1 M2 bp1 D
L
E1
vMAB
M3
HE D1 SENSOR DIE POSITION centre of reading point
*
L2
1
e1 e
2
bp
3
c 0 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) 1.7 1.4 bp 0.8 0.7 bp1 1.57 1.47 c 0.3 0.24 D(2) 4.1 3.9 D1(2) E(2) 5.7 5.5 4.5 4.3 E1(2) 5.7 5.5 e 4.6 4.4 e1 2.35 2.15 HE 18.2 17.8 HE1 5.6 5.5 K max. 5.37 L 7.55 7.25 L1 1.2 0.9 L2 3.9 3.5 M1 8.15 7.85 M2 8.15 7.85 M3(1) 4.7 4.3 Q 0.75 0.65 v 0.25
Notes 1. Glue thickness not included. 2. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT477B REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 99-09-23 00-08-31
2000 Sep 05
9
Philips Semiconductors
Product specification
Integrated rotational speed sensor
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development DEFINITIONS (1)
KMI16/1
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2000 Sep 05
10
Philips Semiconductors
Product specification
Integrated rotational speed sensor
NOTES
KMI16/1
2000 Sep 05
11
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For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613520/02/pp12
Date of release: 2000
Sep 05
Document order number:
9397 750 07248

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